Flux

The MFR 301 is a no clean high activity Liquid Flux for surfaces with poor solderability from the pioneers of no clean technology.
It is recommended for general electrical soldering applications. It can be applied by any of the usual techniques - foam, spray or wave. It is recommended for use on copper or tin-lead coated PCBs. It will solder satisfactorily over most rosin-based preservatives. It is recommended that the rosin based preservative be applied no longer than 3 months before soldering, since the period of protection is limited dependent on storage conditions. Multicore MFR301 has been formulated to work over a wide range of solder resists. It has been formulated for use in foam, spray or wave fluxers in the same way as ordinary fluxes on standard wave soldering machines. For foam fluxing it is important to remove excess flux from the circuit boards using the standard air knife or brushes supplied on the wave soldering machine.
Tin-lead compatible
Fast soldering on conventional leaded and SMD components - no bridges or icicles
Exceptional through-hole penetration
Sustained performance for maximum process window
No cleaning
Minimal residues to interfere with ATE probes without cleaning
Compatible with rosin based surface preservatives
Foam, spray or wave application
Applications
Maintenance & Repair