{"product_id":"mg-solder-paste-lead-free-no-clean-25g-mg4900p-25g","title":"MG Solder Paste, Lead Free, No-Clean 25g","description":"MG Chemicals SAC305 T3 No Clean Solder Paste is made from a blend of virgin high purity non-recycled Tin, Silver and Copper metal powder mixed with a No clean flux to form a paste. It is a lead-free, no clean, halogen-free solder paste designed specifically with robust flux activity and enhanced printing characteristics for ultra fine pitch applications. It provides an x-treme fluxing activity level with excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces.\r\n\r\nIn addition it offers repeatable, consistent printing characteristics combined with long stencil and tack life to accommodate high speed printing. This material yields excellent printing capabilities across various board designs and ultra-fine pitch down to 0.3mm pitch with excellent paste release to achieve brick like print results.\r\n\r\nMG Chemicals SAC305 T3 No Clean Solder Paste Features \u0026amp; Benefits\r\n\r\nNo clean formula\r\nEnhanced print characteristics utilizing proprietary paste flux manufacturing techniques\r\nNon-corrosive\r\nThermal stability\r\nShiny and bright solder joints\r\nLow hard non-conductive-tacky residues\r\nLong Tack time\r\nExcellent wettability\r\nSuitable with air or nitrogen atmosphere\r\nMeets J-STD-005A\r\nComplies with RoHS Directive 2002\/95\/EC\r\nMelting point: 217 °C - 221 °C \/ 423 °C - 430 °F","brand":"MG Chemicals","offers":[{"title":"Default Title","offer_id":47025375084782,"sku":"MG4900P-25G","price":62.4,"currency_code":"NZD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0736\/3769\/1630\/files\/4900P-25G.jpg?v=1759194571","url":"https:\/\/www.baskiville.co.nz\/products\/mg-solder-paste-lead-free-no-clean-25g-mg4900p-25g","provider":"Baskiville","version":"1.0","type":"link"}