{"product_id":"pace-tf1800-bga-and-smd-rework-system-8007-0574-8007-0574","title":"Pace TF1800 BGA and SMD Rework System - 8007-0574","description":"Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 and other bottom terminated components. However, today’s extremely high thermal mass boards, ultra-fine pitch components and challenging production rework environments demand greater process control, thermal performance and faster throughput than ever before.\r\n\r\nEnter PACE’s TF 1800 BGA\/SMD Rework System. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF 1800’s top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually any component installation or removal application.","brand":"Pace","offers":[{"title":"Default Title","offer_id":49446011961582,"sku":"8007-0574","price":0.0,"currency_code":"NZD","in_stock":false}],"url":"https:\/\/www.baskiville.co.nz\/products\/pace-tf1800-bga-and-smd-rework-system-8007-0574-8007-0574","provider":"Baskiville","version":"1.0","type":"link"}