{"product_id":"pace-tf2800-bga-and-smd-rework-system-8007-0582-8007-0582","title":"Pace TF2800 BGA and SMD Rework System - 8007-0582","description":"Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 and other bottom terminated components. However, today’s extremely high thermal mass boards, ultra-fine pitch components and challenging production rework environments demand greater process control, thermal performance and faster throughput than ever before.\r\n\r\nEnter PACE’s TF 2800 BGA\/SMD Rework System. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF 2800’s top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually any component installation or removal application.","brand":"Pace","offers":[{"title":"Default Title","offer_id":49576432926958,"sku":"8007-0582","price":0.0,"currency_code":"NZD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0736\/3769\/1630\/files\/8007-0574.jpg?v=1789439789","url":"https:\/\/www.baskiville.co.nz\/products\/pace-tf2800-bga-and-smd-rework-system-8007-0582-8007-0582","provider":"Baskiville","version":"1.0","type":"link"}