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DDD Loctite DAM7010C ECCOBOND 30cc
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DDD Loctite DAM7010C ECCOBOND 30cc

SKU LOCDAM7010C
by Loctite
Sold out
$0.00 - $0.00
$0.00
$0.00
$0.00 - $0.00
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LOCTITE ECCOBOND DAM 7010C is a black epoxy semiconductor encapsulant, formulated to be used in combination with a "fill" encapsulant LOCTITE ECCOBOND FIL 7010C as a dam encapsulant. It is specially designed for glob top, chip on board applications where protection of wire bonded bare IC is required. This two material combination is also suited for the protection of multiple chips and for encapsulating components where a well-defined glob height and flat surface are required. LOCTITE ECCOBOND DAM 7010C has good crack, chemical and thermal resistance along with low thermal expansion. This SVHC free, REACH compliant, high purity, low sag material operates at -40 to 150ºC and is typically used for glob top applications and the encapsulation of bare wire bonded semiconductors. 30 cc MOQ10
Features & Benefits

High Purity, Low Sag Material. Ensures precise application and minimal flow, maintaining defined dam structures.Thermal and Chemical Resistance. Protects sensitive semiconductor components under harsh conditions.Low Thermal Expansion. Reduces stress on wire bonds and components during thermal cycling.Wide Operating Temperature. Functional from -40°C to 150°C.SVHC Free and REACH Compliant. Safe for environmentally sensitive applications.High Reliability. Ideal for glob top and chip-on-board protection, preserving delicate wire bonds.

Specifications

Manufacturer: Loctite (Henkel)Part Number: LOCDAM7010CProduct Type: Epoxy Semiconductor Encapsulant (Dam)Volume: 30ccColor: BlackMaterial Type: Two-component epoxy (used with ECCOBOND FIL 7010C)Operating Temperature: -40°C to 150°CProperties: Crack-resistant, chemically resistant, thermally stable, low thermal expansionCompliance: SVHC Free, REACH CompliantMOQ: 10 units