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Loctite FIL7010C ECCOBOND 30cc
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Loctite FIL7010C ECCOBOND 30cc

SKU LOCFIL7010C
by Loctite
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$0.00 - $0.00
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LOCTITE ECCOBOND FIL 7010C is a low viscosity, one component, SVHC free, epoxy product designed for use as a potting or encapsulation resin protection for stress sensitive electronic components. It is specially formulated with a low thermal expansion and high Tg, along with a toughened polymer backbone making it ideally suited to survive severe thermal shock conditions with a high resistance to micro cracking. LOCTITE ECCOBOND FIL 7010C is a REACH compliant product, designed to survive constant service temperatures of 150°C, with peak temperatures of up to 180°C for chip on board encapsulation. Cure Schedule 2 hours @ 140°C 1 hour @ 100°C plus 1 hour @ 150°C (Low Stress) 30cc MOQ 10
Features & Benefits

Low Thermal Expansion. Minimizes stress on sensitive components during thermal cycling.High Glass Transition Temperature (Tg). Maintains stability under elevated temperatures up to 150°C, with peaks up to 180°C.Toughened Polymer Backbone. Provides resistance to micro-cracking under severe thermal shock.Low Viscosity. Ensures easy application and complete coverage of components.SVHC Free and REACH Compliant. Environmentally safe for industrial electronics applications.One-Component Epoxy. Simplifies handling and curing without mixing.

Specifications

Manufacturer: Loctite (Henkel)Part Number: LOCFIL7010CProduct Type: Epoxy Potting/Encapsulation ResinVolume: 30ccColor: Clear/Translucent (typical for ECCOBOND FIL series)Cure Schedule:2 hours at 140°CLow Stress: 1 hour at 100°C + 1 hour at 150°CThermal Properties: Constant service up to 150°C, peak up to 180°CProperties: Low thermal expansion, high Tg, toughened polymer, resistant to micro-crackingCompliance: SVHC Free, REACH CompliantMOQ: 10 units