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Circuit Medic B4-256-1717-100 Stencil Rework

Circuit Medic B4-256-1717-100 Stencil Rework

SKU CMB4-256-1717-100
by Ciruit Medic
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Circuit Medic Stencil Rework Comes in packets of 10 stencils. 256 Balls - 17mm x 17 mm Body. 1.00mm pitch Flextac Stencils are self-sticking solder paste stencils. These laser cut, polymer stencils use a full-release, residue-free adhesive similar to sticky notes. The self-sticking adhesive on the bottom of the stencil seals around each BGA pad to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface. If you currently use metal stencils you need to fixture them or tape them in position to hold them in place. Metal stencils can warp, and if the circuit board has undulations in the board surface, the metal stencil will not sit flat. Since there is no gasket-like seal, solder paste can easily bleed under metal stencils when paste is applied with a squeegee. Also solder paste can spill out over the sides of flat stencils contaminating the circuit board surface. Part No. B4-256-1717-100 Thickness 004" 0.102 mm Aperture .020" 0.508 mm Balls 256 Ball Pattern 16 x 16 Full Array Pitch .039" 1.00 mm Component 17 mm x 17 mm Pkg./10
Features & Benefits

*Self-sticking adhesive for secure stencil placement and no paste leakage.*Residue-free polymer prevents contamination of PCB surfaces.*Laser-cut design ensures precise solder paste application.*Disposable and easy to use, eliminating the need for fixtures or tape.*Prevents paste overflow and reduces rework or defects.*Ideal for BGA rework, providing consistent, high-quality results.

Specifications

*Manufacturer: Circuit Medic*Part number: B4-256-1717-100*Package: 10 stencils per pack*Stencil material: Polymer with self-sticking adhesive*Stencil thickness: 0.004" (0.102 mm)*Aperture size: 0.020" (0.508 mm)*Ball count: 256*Ball pattern: 16 × 16 full array*Pitch: 0.039" (1.00 mm)*Component size: 17 × 17 mm

More Information

Applications:*Precise solder paste application for BGA components.*PCB rework or repair, even on uneven board surfaces.*Electronics prototyping and small-scale production.*Eliminates solder paste overflow and improves rework efficiency.*Alternative to metal stencils in surface-mount soldering operations.