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Circuit Medic B6-388-3535-127 Stencil Rework

Circuit Medic B6-388-3535-127 Stencil Rework

SKU CMB6-388-3535-127
by Ciruit Medic
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Packets of 10 stencils Flextac Stencils are self-sticking solder paste stencils. These laser cut, polymer stencils use a full-release, residue-free adhesive similar to sticky notes. The self-sticking adhesive on the bottom of the stencil seals around each BGA pad to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface. If you currently use metal stencils you need to fixture them or tape them in position to hold them in place. Metal stencils can warp, and if the circuit board has undulations in the board surface, the metal stencil will not sit flat. Since there is no gasket-like seal, solder paste can easily bleed under metal stencils when paste is applied with a squeegee. Also solder paste can spill out over the sides of flat stencils contaminating the circuit board surface. Part No. B6-388-3535-127 Thickness .006" 0.152 mm Aperture .025" 0.635 mm Balls 388 Ball Pattern 26 x 26 P4-Row + 6 x 6 centre Pitch .050" 1.27 mm Component 35 mm x 35 mm
Features & Benefits

*Self-sticking adhesive for secure stencil placement and no paste leakage.*Residue-free polymer prevents contamination of PCB surfaces.*Laser-cut design ensures precise solder paste application.*Disposable and easy to use, no fixtures or tape required.*Prevents paste overflow and reduces rework or defects.*Ideal for large BGA component rework, providing consistent, high-quality results.

Specifications

*Manufacturer: Circuit Medic*Part number: B6-388-3535-127*Package: 10 stencils per pack*Stencil material: Polymer with self-sticking adhesive*Stencil thickness: 0.006" (0.152mm)*Aperture size: 0.025" (0.635mm)*Ball count: 388*Ball pattern: 26 Ɨ 26 P4-Row + 6 Ɨ 6 center*Pitch: 0.050" (1.27mm)*Component size: 35 Ɨ 35mm

More Information

Applications:*Precise solder paste application for large BGA components.*PCB rework or repair, including boards with uneven surfaces.*Electronics prototyping and small-scale production.*Prevents solder paste overflow and improves rework efficiency.*Replacement for metal stencils in surface-mount soldering operations.