Hakko Hot Air Nozzle BGA 27 x 27mm

*Optimized for BGA components sized 27 mm × 27 mm.*Provides uniform hot air distribution for reliable reflow performance.*Supports vacuum pickup functionality where the host station provides it.*Enhances component removal and placement efficiency while minimizing thermal stress.*Built from durable high-temperature materials to withstand repeated use.*Compatible with lead-free soldering workflows.*RoHS compliant and designed to be ESD-safe.

*Manufacturer: Hakko*Part number: A1475*SKU: HKA1475*Nozzle type: BGA hot air nozzle*Working size: 27 mm × 27 mm × 15 mm height*Compatible with: FR-811; FR-810B or FR-810 (requires adapter B5058); FR-803B; FR-802; FR-801; 850 series; 852 series*Vacuum pickup support: Yes (operative nozzle)*Style: Conventional (non-quick-change) nozzle*Material/Safety: RoHS compliant; ESD-safe; compatible with lead-free soldering

Uses:*Ideal for reworking or reflowing BGA packages sized 27 mm × 27 mm on printed circuit boards*Commonly used in electronics manufacturing, R&D, and repair facilities that handle medium-large BGA devices*Supports vacuum-assisted pickup for cleaner and more efficient component removal or placement*Suitable for environments requiring precise thermal control, such as industrial or lab-based rework stations*Compatible with both manual and programmable workflows using supported Hakko hot-air systems