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📞 Free NZ: 0800 227 548 | 🌎 Int: +64 (0) 3 302 8703 | ✉️ Contact Us
Hakko Hot Air Nozzle BGA

Hakko Hot Air Nozzle BGA

SKU HKA1473
by Hakko
Sold out
$0.00 - $0.00
$0.00
$0.00
$0.00 - $0.00
$0.00
The Hakko A1473 is a conventional-style hot air nozzle designed for BGA components measuring 16 mm × 16 mm with a 25 mm height. It is compatible with a wide range of Hakko rework stations, including FR-811, FR-810B (with adapter B5058 if needed), FR-803B, FR-802, FR-801, and the 850 and 852 series. This nozzle is tailored for precise hot air reflow or removal of medium-sized BGA (ball grid array) packages.
Features & Benefits

*Designed specifically for BGA components sized 16 mm × 16 mm.*Supports precise and uniform hot air targeting for medium-sized BGAs.*Compatible with vacuum pick-up operations on applicable stations.*Enhances efficiency and reduces thermal stress during component rework.*Durable construction for repeated high-temperature applications.*Suitable for lead-free soldering workflows.*RoHS compliant and ESD-safe in design.

Specifications

*Manufacturer: Hakko*Part number: A1473*Type: BGA hot air nozzle*Working size: 16 mm × 16 mm × 25 mm height*Compatible with: FR-811, FR-810B (or FR-810 with adapter B5058), FR-803B, FR-802, FR-801, 850 series, 852 series*Vacuum function: Supported*Series: Conventional type hot air nozzle (non-quick-change)*Material/Safety: RoHS compliant, ESD-safe, suitable for lead-free soldering

More Information

Uses:*Ideal for reflow or removal of BGA packages measuring 16 mm × 16 mm in PCB repair and assembly.*Commonly used in electronics manufacturing and laboratory rework settings.*Supports vacuum-assisted component pickup for cleaner and more efficient removal.*Useful for industrial and precision repair environments requiring precise thermal control.*Compatible with both manual and programmed rework workflows.