Skip to content
📞 Free NZ: 0800 227 548 | 🌎 Int: +64 (0) 3 302 8703 | ✉️ Contact Us
📞 Free NZ: 0800 227 548 | 🌎 Int: +64 (0) 3 302 8703 | ✉️ Contact Us
Hakko Hot Air Nozzle For 850/850 QFP 10 X 10

Hakko Hot Air Nozzle For 850/850 QFP 10 X 10

SKU HKA1125B
by Hakko
Sold out
$0.00 - $0.00
$0.00
$0.00
$0.00 - $0.00
$0.00
The Hakko A1125B is a precision QFP-style hot air nozzle measuring 10.2 × 10.2 mm, designed expressly for fine-pitch IC packages. It is intended for use with Hakko hot air rework stations such as FR-802, FR-803B, FR-811, FR-850, FR-852, and select others. Engineered for even airflow and accurate thermal coverage, this nozzle simplifies the rework process for quad flat-pack (QFP) components.
Features & Benefits

*Delivers a 10.2 × 10.2 mm rectangular hot air profile optimized for QFP packages.*Precisely machined to ensure uniform air distribution over all pins.*Compatible with multiple Hakko rework systems including FR-801 through FR-852 models.*Durable construction to withstand repeated thermal cycling.*Designed for efficient preheating, removal, or placement of QFP devices.

Specifications

*Manufacturer: Hakko*Part Number: A1125B*SKU: HKA1125B*Nozzle Shape: QFP-style rectangular*Inside Dimensions: 10.2 × 10.2 mm (0.40 in × 0.40 in)*Compatible Hot-Air Stations: FR-802, FR-803B, FR-811, FR-810B, FR-850, FR-852 (Adapter may be required for FR-810 without B5058 adapter)*Material: Heat-resistant alloy or stainless steel suited for high temperatures

More Information

Applications:*Precision rework of Quad Flat Package (QFP) integrated circuits.*Effective for soldering, preheating, and removal of QFP ICs on dense PCB layouts.*Ideal in electronics manufacturing, SMT repair, and prototype debugging.*Prevents component damage by applying uniform heat distribution during removal or installation.*Supports both lead-free and conventional soldering workflows in high-frequency rework environments.

Operators Manual