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📞 Free NZ: 0800 227 548 | 🌎 Int: +64 (0) 3 302 8703 | ✉️ Contact Us
Hakko Hot Air Nozzle For 850/852 QFP 14 X 20

Hakko Hot Air Nozzle For 850/852 QFP 14 X 20

SKU HKA1128B
by Hakko
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$0.00 - $0.00
$0.00
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$0.00 - $0.00
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The Hakko A1128B is a specially designed QFP-pattern hot air nozzle with an inner opening of approximately 15.2 × 21.2 mm (0.60 × 0.83 in). This nozzle is part of the A11 series, optimized for quad flat-pack (QFP) IC rework. It provides consistent, even heat distribution across all pins and is compatible with Hakko hot-air rework systems - including FR-801, FR-802, FR-803 (and B version), FR-811, and the FR-850/852 series. Use of an adapter (B5058) may be required for FR-810 models.
Features & Benefits

*Precisely sized for QFP IC packages measuring approximately 15.2 × 21.2 mm.*Machined to ensure uniform airflow distribution across all leads of the IC.*Compatible across multiple Hakko hot-air rework systems, including 850 and 852 models.*Built from heat-resistant metal alloy for long-term durability under repeated thermal cycle use.*Minimizes thermal impact on adjacent pads or components during QFP removal or placement.

Specifications

*Manufacturer: Hakko*Part Number: A1128B*SKU: HKA1128B*Nozzle Type: QFP-pattern hot air nozzle (QFP-100 series)*Internal Dimensions: Approximately 15.2 × 21.2 mm (0.60 × 0.83 in)*Compatible Stations: FR-801, FR-802, FR-803/B, FR-811, FR-850, FR-850B/D, FR-852 (adapter may be required for FR-810)*Material: Heat-resistant metal alloy

More Information

Applications:*Removal and rework of QFP ICs ensuring even heat distribution over all pins.*Reflow soldering or solder bridge correction on QFP packages in dense PCB layouts.*Used in electronics manufacturing, SMT labs, prototype development, and service benches.*Ideal for both lead-free and leaded solder workflows requiring precise thermal control.*Prevents collateral heat damage to surrounding components and helps minimize PCB warpage.

Operators Manual