Hakko Hot Air Nozzle For 850/852 QFP 17.5 X 17.5

*Optimized for QFP-style IC packages, matching a 19.2 × 19.2 mm footprint.*Precisely machined for uniform airflow distribution across all pins of the component.*Compatible with a broad range of Hakko rework stations, including FR-801, FR-802, FR-803, FR-803B, FR-811, FR-850 series, and FR-852.*Durable, heat-resistant construction supports repeated thermal cycling.*Enhances efficiency in component removal or placement without affecting adjacent components.

*Manufacturer: Hakko*Part Number: A1127B*SKU: HKA1127B*Nozzle Type: QFP rectangle*Inner Dimensions: 19.2 × 19.2 mm (0.76 × 0.76 in)*Compatible Stations: Works with FR-801, FR-802, FR-803, FR-803B, FR-811, FR-850, FR-850B, FR-850D, and FR-852 systems; may require adapter for older FR-810 models.*Material: Heat-resistant metal or alloy suitable for precise hot-air rework

Applications:*Ideal for rework of QFP ICs, ensuring balanced heat distribution over all pins.*Suitable for uniform preheating of QFP chips before removal or repositioning.*Commonly used in SMT repair, electronics manufacturing, and prototype development where QFP devices are present.*Helps prevent thermal damage to neighboring components or fingerprints.*Supports lead-free and conventional solder processes for fine-pitch surface mount rework.