Hakko Hot Air Nozzle For 850/852 QFP 20mm x 20mm

*Specifically sized for QFP packages measuring approximately 20 × 20 mm.*Vacuum pick-up function is operative when used with compatible Hakko systems.*Provides uniform airflow surrounding the full perimeter of the component for even heating.*Enables controlled reflow and safe removal of medium-sized QFP devices.*Constructed from durable materials to maintain consistent thermal performance and reliability over time.

*Manufacturer: Hakko*Part number: A1261B*SKU: HKA1261B*Nozzle type: QFP hot air nozzle*Aperture size: Approximately 20.2 × 20.2 mm*Compatible systems: Hakko FR-801, FR-802, FR-803, FR-803B, FR-810B, FR-811, and 850, 850B, 850D, 852 (requires adapter B5058 for FR-810/FR-811)*Vacuum pick-up support: Yes, when used with systems that support vacuum function

Uses:*Reworking QFP-type integrated circuit packages approximately 20 × 20 mm on printed circuit boards.*Performing precision soldering or desoldering of medium-size QFP devices during repair, diagnostics, or prototyping.*Conducting controlled reflow in dense SMT layouts while reducing heat impact on adjacent components.*Ideal for use in service centers, production environments, and R&D labs with Hakko hot air systems.*Suitable for vacuum-assisted component removal or placement for safe and clean rework operations.