Hakko N51-15 BGA Nozzle 14mm x 14mm for FR810/FR811
SKU HKN51-15
by Hakko
Sold out
Original price
$0.00
-
Original price
$0.00
Original price
$0.00
$0.00
$0.00
-
$0.00
Current price
$0.00
The Hakko N51-15 is a precision hot-air nozzle with a 14 mm Ć 14 mm opening designed for the removal and rework of BGA (Ball Grid Array) packages. It is compatible with the Hakko FR-810, FR-810B, and FR-811 hot-air rework stations. This nozzle delivers concentrated airflow directly to the component area, enabling efficient solder reflow or removal while minimising heat impact on surrounding components.
Applications:
*Precise BGA component rework in electronics manufacturing and repair.
*Targeted hot-air reflow for electrical circuit boards with dense component layouts.
*Servicing automotive electronics modules requiring accurate temperature control.
*Production, maintenance, and rework operations using Hakko FR-810/FR-810B/FR-811 stations.
*Ideal for any environment needing consistent and repeatable hot-air delivery to specific component sizes.