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📞 Free NZ: 0800 227 548 | 🌎 Int: +64 (0) 3 302 8703 | ✉️ Contact Us
Hakko N51-21 BGA Nozzle 24mm x 24mm for FR810/FR811

Hakko N51-21 BGA Nozzle 24mm x 24mm for FR810/FR811

SKU HKN51-21
by Hakko
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$0.00 - $0.00
$0.00
$0.00
$0.00 - $0.00
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The Hakko  N51-21 is a quick-change type hot-air nozzle designed for BGA component re-work. It features a 24 mm × 24 mm outlet size, making it suitable for larger BGA packages on densely populated PCBs. It is compatible with the Hakko FR-810, FR-810B and FR-811 rework systems. This nozzle enables targeted hot-air delivery, helping minimise heat transfer to adjacent components and improving reliability in electronics repair, production or service environments - particularly in electrical, electronics and automotive modules. *Applications: *Electronics repair and re-work of large BGA chips on PCBs. *Automotive module service including ECUs, infotainment boards and control modules. *Electrical control systems and industrial instrumentation PCB maintenance. *Production and repair of high-density assemblies in consumer electronics, medical devices and networking equipment. *Training and process improvement in hot-air re-work operations where correct nozzle sizing is critical.
Features & Benefits

*Quick-change mounting style allowing fast nozzle swaps, improving workflow.*Outlet inner dimensions of 24 mm × 24 mm to match large BGA package footprints.*Compatible with Hakko FR-810, FR-810B and FR-811 rework systems.*Durable construction suited to high-temperature hot-air environments.*Focused heating reduces thermal stress on surrounding components, enhancing re-work quality.

Specifications

*Manufacturer: Hakko*Part Number: N51-21*SKU: HKN51-21*Nozzle Type: BGA hot-air nozzle (quick-change type)*Outlet Inner Dimensions: 24 mm × 24 mm*Suitable For: Hakko FR-810, FR-810B, FR-811

More Information

*Applications:*Electronics repair and re-work of large BGA chips on PCBs.*Automotive module service including ECUs, infotainment boards and control modules.*Electrical control systems and industrial instrumentation PCB maintenance.*Production and repair of high-density assemblies in consumer electronics, medical devices and networking equipment.*Training and process improvement in hot-air re-work operations where correct nozzle sizing is critical.