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📞 Free NZ: 0800 227 548 | 🌎 Int: +64 (0) 3 302 8703 | ✉️ Contact Us
Hakko N51-25 BGA Nozzle 38mm x 38mm for FR810/FR811

Hakko N51-25 BGA Nozzle 38mm x 38mm for FR810/FR811

SKU HKN51-25
by Hakko
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$0.00 - $0.00
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$0.00 - $0.00
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The Hakko N51-25 is a large-footprint BGA hot-air rework nozzle sized 38 mm × 38 mm, designed for use with Hakko FR-810, FR-810B and FR-811 rework stations. It is engineered for removal and replacement of very large ball-grid-array (BGA) packages on densely populated PCBs. By matching the nozzle outlet size to the component footprint, the N51-25 facilitates efficient, focused hot-air delivery while reducing heat exposure to adjacent components—ideal for electronics, electrical and automotive module rework tasks.
Features & Benefits

*Quick-change style mounting for fast and efficient nozzle swaps.*Outlet inner dimensions of 38 mm × 38 mm tailored for very large BGA packages.*Compatible with Hakko FR-810, FR-810B and FR-811 rework systems.*Robust metal construction for high-temperature hot-air applications.*Focused airflow helps reduce thermal stress on neighbouring components, improving re-work reliability and yield.

Specifications

*Manufacturer: Hakko*Part Number: N51-25*SKU: HKN51-25*Nozzle Type: BGA hot-air nozzle (quick-change style)*Outlet Inner Dimensions: 38 mm × 38 mm*Suitable For: Hakko FR-810, FR-810B, FR-811

More Information

Applications:*Re-work and repair of very large BGA chips on printed circuit boards (PCBs).*Service of automotive modules and control units where large BGA packages are used.*Maintenance of high-density electronics, electrical systems and industrial instrumentation boards.*Production line repair or prototype re-work of consumer electronics, networking or medical devices with large-footprint components.*Process improvement & tooling optimisation in hot-air re-work operations requiring matched nozzle size for thermal efficiency.