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MG Solder Paste, Leaded, No-Clean 35G

MG Solder Paste, Leaded, No-Clean 35G

SKU MG4860P-35G
by MG Chemicals
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$0.00 - $0.00
$0.00
$78.50
$78.50 - $78.50
$78.50
MG Solder Paste No Clean 250G Type 3 (45>25 µm) MG Chemicals Sn63/Pb37 No Clean Solder Paste is made from a blend of virgin high purity non-recycled Tin and Lead metal powder blended with a No Clean flux to form a paste. Designed for surface mount applications, it provides high tack force and good wettability. The post soldering transparent residues are non-conductive, non-corrosive and highly insulated. The name no clean refers to the fact that the flux residues are not harmful to assemblies and does not mean there will be no residues. MG Chemicals Sn63/Pb37 No Clean Solder Paste Features & Benefits * No clean formula * Low residues * Excellent wettability * Non-corrosive flux residue * Non-conductive flux residue * J-STD-006C compliant * Melting point: 183 °C / 361 °F
Features & Benefits

No clean formula Low residues Excellent wettability Non-corrosive flux residue Non-conductive flux residue J-STD-006C compliant Melting point: 183 °C / 361 °F

Specifications

Manufacturer: MG ChemicalsPart Number: MG4860P-35GProduct Type: Leaded No-Clean Solder PasteAlloy Composition: Sn63/Pb37Particle Size: Type 3 (45 to 25 microns)Weight: 35 gramsFlux Type: No-cleanMelting Point: 183 °C / 361 °FResidue Characteristics: Transparent, non-conductive, non-corrosiveCompliance: J-STD-006C

Technical Data Sheet (TDS)