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Quick Lead Free Hot Air Rework Centre 1300w output

Quick Lead Free Hot Air Rework Centre 1300w output

SKU QUITR1350
by Quick
Sold out
$0.00 - $0.00
$0.00
$2,475.00
$2,475.00 - $2,475.00
$2,475.00
TR1350 Power 1300W Operating voltage 110V/ 220V AC Temperature range 100 to 500 Deg C Air volume 6-70 L/Min Overall dimensions 215 x 230 x 155 (mm) Split type hot air pen Program fast switch ESD grounding monitoring Network communication Temperature automatic correction Programmable temperature zone #Applications Suitable for reworking various components, such as SOIC, CHIP, QFP, SOP, PLCC, SOJ, BGA and QFN Application: Heat shrinkage, drying, paint removal, defrostation, preheating, sterilizing, adhesive soldering etc. Air volume adjustable, suitable for small and large air volume heating occasions. Suitable for lead-free hot air reworking occasion.
Features & Benefits

High Power Output (1300 W): Rapid heating for efficient soldering and rework.Wide Temperature Range (100ā€“500Ā°C): Suitable for a wide variety of components and lead-free soldering.Adjustable Air Volume (6ā€“70L/min): Flexible for small or large surfaces, allowing controlled heat application.Programmable Temperature Zones: Enables precise and repeatable temperature settings for complex workflows.Automatic Temperature Correction: Maintains stable and accurate temperatures for consistent results.Split-Type Hot Air Pen: Lightweight and ergonomic for precise handling during rework.Fast Switch Programs: Quick access to commonly used temperature and airflow settings.ESD Grounding Monitoring: Protects sensitive electronic components from electrostatic discharge.Network Communication: Supports monitoring, integration, and process control in professional environments.

Specifications

TR1350Power 1300WOperating voltage 110V/ 220V ACTemperature range 100 to 500 Deg CAir volume 6-70 L/MinOverall dimensions 215 x 230 x 155 (mm)Split type hot air penProgram fast switchESD grounding monitoringNetwork communicationTemperature automatic correctionProgrammable temperature zone

More Information

Suitable for reworking various components, such as SOIC, CHIP, QFP, SOP, PLCC, SOJ, BGA and QFN Application: Heat shrinkage, drying, paint removal, defrostation, preheating, sterilizing, adhesive soldering etc. Air volume adjustable, suitable for small and large air volume heating occasions. Suitable for lead-free hot air reworking occasion.