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📞 Free NZ: 0508 227 548 | 🌎 Int: +64 (0) 3 302 8703 | ✉️ Contact Us
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Pace TF2800 BGA and SMD Rework System - 8007-0582

SKU 8007-0582
by Pace
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$0.00 - $0.00
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$0.00 - $0.00
Price on Request
Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 and other bottom terminated components. However, today’s extremely high thermal mass boards, ultra-fine pitch components and challenging production rework environments demand greater process control, thermal performance and faster throughput than ever before. Enter PACE’s TF 2800 BGA/SMD Rework System. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF 2800’s top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually any component installation or removal application.
Features & Benefits

Genuine PACE ThermoFlo BGA/SMD rework system.PACE P/N 8007-0582.120 VAC, 50/60 Hz configuration.Designed for larger PCB assemblies.Supports PCBs up to 610mm x 610mm (24in x 24in).1900W medium/long-wave IR bottom-side preheater.Seven high-powered IR emitters for large, high-thermal-mass assemblies.Bottom-side preheater height adjustable up to 38mm (1.5in) closer to the PCB.Adjustable/removable board support beam.Up to four stationary adjustable-height support pins.Designed for BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 and other bottom-terminated components.Patented PACE Inductive-Convection Heating Technology.Compatible with PACE TF Series nozzles.Professional solution for production and high-thermal-mass PCB rework.

Specifications

Brand: PACEProduct Type: BGA and SMD Rework SystemModel: TF2800Series: ThermoFloPart Number: 8007-0582Voltage: 120 VACFrequency: 50/60 HzMaximum Power: 2400 WRequired Supply: Dedicated 20 A supplyPCB Capacity: Maximum 610mm x 610mm (24in x 24in)Minimum PCB Size: No minimumBottom-Side Preheater: 1900 W medium/long-wave IRIR Emitters: 7Preheater Height Adjustment: Up to 38mm (1.5in) closer to PCBDimensions: 737mm H x 1118mm W x 965mm DWeight: 90kg (200lbs), without computerApplication: BGA/SMD ReworkComponent Applications: BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 and other bottom-terminated componentsBoard Support: Adjustable/removable support beam plus adjustable support pins