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Chemtools NO Clean Flux Gel/ Paste 10cc (20g)

Chemtools NO Clean Flux Gel/ Paste 10cc (20g)

SKU CTNCFP-S10-PT
by Chemtools
$0.00 - $0.00
$0.00
$32.76
$32.76 - $32.76
$32.76
No Clean Flux Gel/Paste (NCFP) is a tacky rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. It can be used for the general touch-up or rework of printed circuit boards, as well as for attaching spheres to ball grid array (BGA) packages. The superior wetting ability of NCFP results in bright, smooth, and shiny solder joints, whether reflowed by hand, hot-air rework station, convection reflow oven, or vapor phase soldering systems. Residues that remain on surfaces after soldering are clear, leaving a cosmetically appealing repair that can be easily pin probed during in-circuit tests. No Clean Flux Gel/Paste is compatible with all tin-lead and lead-free alloys and can be applied by brush or cotton swab, dispense needle, pin transfer, or stencil printing. When being used in rework, application should be limited to the area being worked. NCFP needs to see an SMT style reflow profile to render it fully inactive. #Specifications Size: 10cc

Stock available: 6

Features & Benefits

*Superior wetting ability: Produces bright, smooth, and shiny solder joints.*No-clean formulation: Leaves clear residues suitable for in-circuit testing.*Versatile rework compatibility: Works with hand soldering, hot-air rework, convection ovens, and vapor phase systems.*Alloy compatible: Suitable for tin-lead and lead-free solder alloys.*Flexible application methods: Can be applied via brush, cotton swab, dispense needle, pin transfer, or stencil printing.*Localized application: Limits flux to the area being worked for precise rework.*SMT reflow compatible: Fully inactive when subjected to proper reflow profiles.

Specifications

*Manufacturer: Chemtools*Part number: CTNCFP-S10-PT*Product type: No Clean Flux Gel/Paste*Size / Volume: 10cc (20g)*Alloy compatibility: Tin-lead and lead-free*Application method: Brush, cotton swab, dispense needle, pin transfer, stencil printing*Reflow requirement: Requires SMT-style reflow to render fully inactive

More Information

Applications:*PCB rework and repair: Touch-ups, component replacement, and solder joint correction.*BGA assembly: Attaching spheres to ball grid array packages.*Electronics manufacturing: Localized fluxing for surface mount or through-hole components.*Laboratory and prototyping: Assembling and testing prototype boards.*General soldering: Hand soldering and machine-assisted reflow processes.