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Circuit Medic B4-048-0709-075 Stencil Rework

Circuit Medic B4-048-0709-075 Stencil Rework

SKU CMB4-048-0709-075
by Ciruit Medic
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Packet of 10 stencils Flextac Stencils are self-sticking solder paste stencils. These laser cut, polymer stencils use a full-release, residue-free adhesive similar to sticky notes. The self-sticking adhesive on the bottom of the stencil seals around each BGA pad to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface. If you currently use metal stencils you need to fixture them or tape them in position to hold them in place. Metal stencils can warp, and if the circuit board has undulations in the board surface, the metal stencil will not sit flat. Since there is no gasket-like seal, solder paste can easily bleed under metal stencils when paste is applied with a squeegee. Also solder paste can spill out over the sides of flat stencils contaminating the circuit board surface. Part No. B4-048-0709-075 Thickness 004" 0.102 mm Aperture .017" 0.432 mm Balls 48 Ball Pattern 6 x 8 Array Pitch .0295" 0.75 mm Component 7 mm x 9 mm
Features & Benefits

*Self-sticking adhesive for secure placement and no paste leakage.*Residue-free polymer material prevents contamination of PCB surfaces.*Laser-cut precision ensures accurate solder paste deposition.*Disposable and easy to use, eliminating the need for fixtures or tape.*Prevents paste overflow and reduces rework or defects.*Ideal for BGA component rework with consistent, high-quality results.

Specifications

*Manufacturer: Circuit Medic*Part number: B4-048-0709-075*Package: 10 stencils per pack*Stencil material: Polymer, self-sticking adhesive*Stencil thickness: 0.004" (0.102mm)*Aperture size: 0.017" (0.432mm)*Ball count: 48*Ball pattern: 6 Ɨ 8 array*Pitch: 0.0295" (0.75mm)*Component size: 7 Ɨ 9mm

More Information

Applications:*Precise solder paste application for BGA components.*Rework or repair of PCB assemblies with uneven surfaces.*Electronics prototyping and small-scale production.*Eliminates solder paste overflow and improves rework efficiency.*Replacement for metal stencils in surface-mount soldering operations.