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Desco Kapton Tape 0.5" (12mm) x 36 Yds - DES81271

SKU DES81271
by Desco
Original price $0.00 - Original price $0.00
Original price $0.00
$139.26
$139.26 - $139.26
Current price $139.26
TAPE, WESCORP, POLYIMIDE, HI TEMP, 1/2 IN x 36 YDS

* Removal leaves little or no residue
* Masking off PCBs for IR reflow ovens or wave soldering under
572°F (300°C) ~ 10 seconds
* Near zero voltage generation when tape removed from PCB
(at 50% relative humidity)
* Near zero voltage generation when tape unrolled from roll
(at 50% relative humidity)
* Low-sloughing plastic core
* Ideal for masking gold leads and other components on boards
populated with sensitive integrated circuits
* For best results apply to board using a rubber roller
* Adhesive surface resistivity
10E3 to 10E4 Ohms
* Max Temperature
572°F (300°C) 10 seconds
* Adhesive Strength
1 N/cm (DIN), 5 oz./in2 (ASTM)
* 1.0 mil thick (0.0254mm) Polyimide Film (DuPont Kapton® or equivalent)
* Conductive Polysiloxide Adhesive
* Total Thickness
0.060 mm (DIN), 2.4 mil (ASTM)
* Colour
Brown opaque
* Adhesive Type
Silicone
* Tensile Strength
50 N/cm (DIN), 28 lbs/in2 (ASTM)
* Elongation
70% (DIN & ASTM)
* Lead-free RoHS compliant

Stock available: 4

Features & Benefits

• High-Temperature Resistance: Withstands up to 572°F (300°C) for short durations (10 seconds).• Near Zero Static Generation: Prevents voltage spikes during tape removal or unrolling (50% RH).• Clean Removal: Leaves little or no residue, protecting delicate components.• Low-Sloughing Core: Durable polyimide film ensures easy handling.• ESD-Safe Adhesive: Conductive polysiloxide adhesive with surface resistivity 10E3–10E4 ohms.• Durable & Flexible: 1.0 mil (0.0254 mm) film thickness, 70% elongation, high tensile strength.• Lead-Free & RoHS Compliant.

Specifications

• Manufacturer: Desco• Part Number: DES81271• Product Type: High-Temperature Kapton Tape• Width: 0.5 inch (12 mm)• Length: 36 yards (32.9 m)• Film Material: Polyimide (DuPont Kapton® or equivalent)• Adhesive: Silicone, conductive polysiloxide• Total Thickness: 0.060 mm (2.4 mil)• Adhesive Strength: 1 N/cm (DIN), 5 oz/in² (ASTM)• Tensile Strength: 50 N/cm (DIN), 28 lbs/in² (ASTM)• Elongation: 70% (DIN & ASTM)• Surface Resistivity: 10E3–10E4 ohms• Max Temperature: 572°F (300°C) for 10 seconds• Color: Brown opaque• Compliance: Lead-Free, RoHS Compliant

More Information

Applications• Masking PCBs during IR reflow or wave soldering• Protecting gold leads and sensitive integrated circuits• Temporary insulation and surface protection in high-temperature processes• ESD-sensitive electronics assembly and testing

Technical Data Sheet (TDS)