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📞 Free NZ: 0800 227 548 | 🌎 Int: +64 (0) 3 302 8703 | ✉️ Contact Us
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Europlacer Rotary Dip Fluxer

SKU EUE113481
by Europlacer
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The Europlacer Rotary Dip Fluxer (E113481) is an intelligent rotary fluxing station designed for Flip Chip and Package-on-Package (PoP) assembly processes. Fully integrated into the Europlacer pick-and-place machine as a standard intelligent feeder, it applies a precise and controlled layer of flux or solder paste to component interconnections immediately before placement. The removable rotating disc features precision-machined cavities, typically 150 µm and 250 µm deep, ensuring consistent fluid thickness while allowing customized cavity depths for specific applications. The complete dipping operation is integrated into the machine placement cycle for maximum throughput and repeatability.
Features & Benefits

Genuine Europlacer intelligent feederDesigned for Flip Chip and Package-on-Package (PoP) assemblyApplies flux or solder paste before component placementFully integrated into the machine placement cyclePrecision-controlled flux thicknessStandard cavity depths of 150 µm and 250 µmCustom cavity depths availableAdjustable component dwell time in fluxAutomatic flux refresh through rotating discIntelligent feeder electronicsEasy removal of rotating disc for cleaning and replacementConsistent and repeatable flux depositionSupports high-yield advanced packaging processesCompatible with all Europlacer SMT placement platforms

Specifications

Manufacturer: EuroplacerProduct Name: Rotary Dip FluxerPart Number: E113481Type: Intelligent Rotary Fluxing StationApplication: Flip Chip and Package-on-Package (PoP)Compatible Machines: All Europlacer SMT Pick & Place PlatformsMaximum Component Size: 50 × 50 mmMinimum Flux Thickness: 50 µmStandard Disc Cavity Depths: 150 µm and 250 µmCustom Disc Thicknesses: AvailableMaximum Dipping Time: 1 secondFlux Type: Flux or Solder PasteOperation: Fully integrated automatic dipping cycleIntelligence: Integrated Europlacer feeder electronicsTypical Applications:Package-on-Package (PoP)Flip Chip AssemblyAdvanced PackagingBGA AssemblySemiconductor Packaging