Hakko Hot Air Nozzle For 850/852, QFP 40mm x 40mm

*Specifically crafted for QFP components around 40 × 40 mm in size.*Vacuum pick-up function remains operative on compatible Hakko rework systems.*Delivers uniform airflow completely around component edges for balanced and efficient heating.*Enables precise removal or placement of large-format QFP devices.*Fabricated from robust materials to ensure long-term thermal performance and stability.

*Manufacturer: Hakko*Part number: A1264B*SKU: HKA1264B*Nozzle type: QFP large-format hot air nozzle*Aperture size: Approximately 40.4 × 40.4 mm*Compatible systems: Hakko FR-801, FR-802, FR-803B, FR-810B, FR-811, 850, 850B, 850D, 852 (adapter required for FR-810/811)*Vacuum pick-up support: Yes, when used on systems supporting vacuum-assisted functionality

Uses:*Ideal for reworking large 40 × 40 mm QFP packages on printed circuit boards.*Suitable for precision soldering or desoldering of high-pin-count ICs in repair, prototyping, and production.*Enables controlled reflow in dense SMT assemblies while minimizing thermal stress on surrounding components.*Well-suited for R&D labs, electronics service centers, and manufacturing environments using Hakko hot air systems.*Compatible with vacuum-assisted component removal or placement to maintain clean, accurate rework operations.