Skip to content
📞 Free NZ: 0800 227 548 | 🌎 Int: +64 (0) 3 302 8703 | ✉️ Contact Us
📞 Free NZ: 0800 227 548 | 🌎 Int: +64 (0) 3 302 8703 | ✉️ Contact Us
Hakko Hot Air Nozzle

Hakko Hot Air Nozzle

SKU HKA1477
by Hakko
Sold out
$0.00 - $0.00
$0.00
$0.00
$0.00 - $0.00
$0.00
The Hakko A1477 is a conventional-style hot air nozzle designed for BGA components sized around 38 mm × 38 mm with a 15 mm height. It is compatible with multiple Hakko hot-air rework stations including FR-850, FR-852, FR-801, FR-802, and FR-803B. The nozzle is vacuum-operative and optimized for precise, uniform heating of larger BGA devices to facilitate safe removal and installation.
Features & Benefits

*Engineered specifically for BGA packages measuring approximately 38 mm × 38 mm.*Designed for even and targeted hot air flow covering the entire component area.*Supports vacuum pickup operation on compatible Hakko rework systems.*Enhances efficiency and reduces thermal stress during BGA removal or placement.*Built from durable materials capable of handling repeated high-temperature use.*Compatible with lead-free soldering workflows.*RoHS compliant and ESD-safe in construction.

Specifications

*Manufacturer: Hakko*Part number: A1477*Nozzle type: BGA hot air nozzle*Working size: 38 mm × 38 mm × 15 mm height*Compatible with: FR-850, FR-852, FR-801, FR-802, FR-803B*Vacuum pickup: Supported (operative nozzle)*Style: Conventional (non-quick-change) nozzle*Material/Safety: RoHS compliant, ESD-safe, suitable for lead-free soldering

More Information

Uses:*Ideal for reflowing or removing BGA components sized about 38 mm × 38 mm on printed circuit boards.*Commonly used in electronics repair, production, and R&D laboratories handling large BGA packages.*Supports vacuum-assisted pickup for clean and precise component removal or placement.*Suitable for controlled thermal rework in industrial, lab, or production environments.*Compatible with both manual and programmable rework workflows on supported Hakko hot-air systems.