Hakko Hot Air Nozzle SOP, For 850/852 8.6mm x 18mm

*Optimized for Small Outline Package (SOP) components sized approximately 8.6 × 18 mm.*Vacuum pickup function is operative when used with compatible Hakko rework systems.*Provides uniform airflow surrounding the package to ensure even heating.*Enables controlled reflow or desoldering of SOP IC devices with minimal thermal spread.*Constructed from durable materials for consistent thermal performance and long-term reliability.

*Manufacturer: Hakko*Part number: A1260B*SKU: HKA1260B*Nozzle type: SOP hot air nozzle*Aperture size: approximately 8.6 × 18 mm*Compatible systems: Hakko 850, 850B, 850D, 852; FR-801, FR-802, FR-803, FR-803B, FR-810B, FR-810 (with adapter B5058), FR-811*Vacuum pickup support: Yes, when used on systems that support vacuum function

Uses:*Reworking SOP integrated circuit packages on printed circuit boards.*Performing precise soldering and desoldering of SOP-type ICs during electronics repair, prototyping, or diagnostics.*Conducting controlled reflow operations in densely packed SMT layouts to limit heat exposure to adjacent components.*Suitable for use in R&D labs, service centers, and production environments operating Hakko 850/852 or FR-80x series rework stations.*Ideal for vacuum-assisted placement or removal of minute SOP IC components with accurate airflow control.