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📞 Free NZ: 0800 227 548 | 🌎 Int: +64 (0) 3 302 8703 | ✉️ Contact Us
Hakko N51-20 BGA Nozzle 22mm x 22mm for FR810/FR811

Hakko N51-20 BGA Nozzle 22mm x 22mm for FR810/FR811

SKU HKN51-20
by Hakko
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$0.00 - $0.00
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$0.00 - $0.00
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The Hakko N51-20 is a BGA hot-air rework nozzle designed for use with the Hakko FR-810, FR-810B, and FR-811 hot-air rework stations. It provides precise, focused airflow for larger BGA packages, ensuring efficient removal and replacement of components with minimal impact on surrounding circuitry. Its quick-change design allows for fast swaps between nozzles, improving workflow in electronics repair, production, or rework environments. This nozzle is particularly suitable for high-density PCBs in electronics, electrical, and automotive applications. Applications: *Electronics repair and rework of large BGA chips on PCBs. *Automotive module service, including ECUs and control boards. *Electrical control systems and industrial instrumentation PCB maintenance. *Production and repair of high-density assemblies in consumer electronics, medical devices, and networking equipment. *Training and process improvement for proper rework practices on large BGA packages.
Features & Benefits

*Quick-change mounting style for fast nozzle swaps.*Outlet inner dimensions of 22 mm × 22 mm for larger BGA components.*Compatible with Hakko FR-810, FR-810B, and FR-811 rework stations.*Durable metal construction for high-temperature hot-air applications.*Provides precise, targeted heating to reduce thermal stress on surrounding components.

Specifications

*Manufacturer: Hakko*Part Number: N51-20*SKU: HKN51-20*Nozzle Type: BGA hot-air nozzle (quick-change style)*Outlet Inner Dimensions: 22 mm × 22 mm*Suitable For: Hakko FR-810, FR-810B, FR-811

More Information

Applications:*Electronics repair and rework of large BGA chips on PCBs.*Automotive module service, including ECUs and control boards.*Electrical control systems and industrial instrumentation PCB maintenance.*Production and repair of high-density assemblies in consumer electronics, medical devices, and networking equipment.*Training and process improvement for proper rework practices on large BGA packages.