Skip to content
📞 Free NZ: 0800 227 548 | 🌎 Int: +64 (0) 3 302 8703 | ✉️ Contact Us
📞 Free NZ: 0800 227 548 | 🌎 Int: +64 (0) 3 302 8703 | ✉️ Contact Us
Hakko N51-24 BGA Nozzle 35mm x 35mm for FR810/FR811

Hakko N51-24 BGA Nozzle 35mm x 35mm for FR810/FR811

SKU HKN51-24
by Hakko
Sold out
$0.00 - $0.00
$0.00
$0.00
$0.00 - $0.00
$0.00
The Hakko  N51-24 is a large-footprint BGA hot-air nozzle sized 35 mm × 35 mm, designed for the Hakko FR-810, FR-810B, and FR-811 hot-air re-work stations. It is engineered to handle large ball-grid-array (BGA) packages and assemblies, providing focused and efficient hot-air delivery to the component footprint while limiting heat exposure to surrounding PCB areas. It is especially suited for demanding electronics repair, high-density PCB assemblies and automotive or industrial module re-work.
Features & Benefits

*Quick-change mounting style for fast and efficient nozzle swaps.*Outlet inner dimensions of 35 mm × 35 mm tailored for very large BGA packages.*Compatible with Hakko FR-810, FR-810B and FR-811 re-work systems.*Robust construction for high-temperature hot-air applications.*Focused airflow reduces thermal stress on neighbouring components, improving re-work reliability and yield.

Specifications

*Manufacturer: Hakko*Part Number: N51-24*SKU: HKN51-24*Nozzle Type: BGA hot-air nozzle (quick-change style)*Outlet Inner Dimensions: 35 mm × 35 mm*Suitable For: Hakko FR-810, FR-810B, FR-811

More Information

Applications:*Re-work and repair of very large BGA chips on printed circuit boards (PCBs).*Service of automotive modules and control units where large BGA packages are used.*Maintenance of high-density electronics, electrical systems and industrial instrumentation boards.*Production line repair or prototype re-work of consumer electronics, networking or medical devices with large-footprint components.*Process improvement & tooling optimisation in hot-air re-work operations requiring matched nozzle size for thermal efficiency.