Pace IR Vacuum Pick Kit 6 sizes

The PACE 6993-0290-P1 is a vacuum pick kit designed for use with PACE’s IR (infrared) rework stations (e.g. IR 3000 / IR 3100 systems). The kit contains six vacuum pick tips in different sizes so users can selectively pick up small components (chips, ICs, SMD parts) during rework or assembly. The vacuum pick tools facilitate non-contact handling of sensitive components, helping reduce mechanical stress or damage during removal or placement. Features & Benefits: *Comes with six different sizes of vacuum pick tips, giving flexibility to handle a range of component sizes. *Compatible with PACE IR rework systems, allowing direct integration into existing workflows. *Enables non-contact component handling via vacuum, which reduces mechanical stress, avoiding damage to delicate parts. *Modular tips allow replacement or interchange, so users don’t need to replace the entire tool if one tip is worn. *Lightweight pick tips minimize load on the vacuum system, helping maintain stable vacuum pressure and control. *Helps in speeding pick & place / removal operations during rework, improving process throughput. *Reduces the risk of dropping or misplacing components during rework due to vacuum grip. Specifications: *Manufacturer / Brand: PACE *Model / Part Number: 6993-0290-P1 *Kit Type: IR Vacuum Pick Kit, 6 sizes (A12) *Intended Use: For use with PACE IR rework / infrared systems (e.g. IR-3000 / IR-3100) *Component Count: 6 vacuum pick tips in different sizes *Tip Material / Construction: Precision vacuum pick tips (material not always specified) *Compatibility: Vacuum pick interface compatible with PACE IR system vacuum port *Packaging: Kit form (all parts together) Applications: *Picking up and placing small surface-mount components (ICs, resistors, capacitors) during rework. *Removing chips, microcontrollers, or other modules safely from PCBs. *Handling delicate or sensitive parts in electronics manufacturing and repair. *Use in repair labs, prototyping, and rework stations for BGA, QFN, and other low-profile components. *Facilitating automated/manual hybrid rework workflows where vacuum pick & place support is needed. *Situations where minimizing mechanical contact or handling stress on small components is critical.