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📞 Free NZ: 0508 227 548 | 🌎 Int: +64 (0) 3 302 8703 | ✉️ Contact Us
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Pace IR3100 Infrared BGA Rework Station - 8007-0586

SKU 8007-0586
by Pace
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The IR 3100 can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's. Featuring a 500W infrared (IR) top heater and a 1000W IR bottom preheater, the IR 3100 does not require nozzles. A specially-developed IR pyrometer provides non-contact, real-time, closed-loop temperature control throughout the reflow process. A Sodr-Cam Reflow Camera comes standard, allowing you to watch the entire reflow process in real time. The IR 3100's newly designed Windows-based software makes profiling incredibly simple for even the most advanced applications, providing intuitive set-up, multi-stage profiling, on-the-fly profile adjustment, flux-dipping, unlimited profile storage and much more.
Features & Benefits

500 W infrared top heater1000 W infrared bottom preheaterNozzles not requiredNon-contact IR pyrometerReal-time closed-loop temperature controlIntegrated Sodr-Cam reflow cameraWindows-based profiling softwareMulti-stage profiling and profile storageSuitable for BGA, QFN, µBGA/CSP, Flip Chip and SMD components

Specifications

Brand: PACE WorldwideModel: IR3100P/N: 8007-0586Top Heater: 500 W IRBottom Preheater: 1000 W IRHeating: InfraredTemperature Control: Non-contact, closed-loop IR pyrometerCamera: Sodr-Cam Reflow CameraApplications: BGA, QFN, µBGA/CSP, Flip Chip, SMD rework