Pace IR3100 Infrared Rework Station 230 Volt

IR3100 Infrared BGA Rework Station The IR 3100 can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's. Featuring a 500W infrared (IR) top heater and a 1000W IR bottom preheater, the IR 3100 does not require nozzles. A specially-developed IR pyrometer provides non-contact, real-time, closed-loop temperature control throughout the reflow process. A Sodr-Cam Reflow Camera comes standard, allowing you to watch the entire reflow process in real time. The IR 3100's newly designed Windows-based software makes profiling incredibly simple for even the most advanced applications, providing intuitive set-up, multi-stage profiling, on-the-fly profile adjustment, flux-dipping, unlimited profile storage and much more. Maximum/Minimum PCB Size - Maximum 305mm x 305mm ; Minimum: N/A arms close down completely. Maximum/Minimum Component Size Maximum - 65mm x 65mm ; Minimum: 1mm Sq. IR Pyrometer and Thermocouple Inputs - A specially developed IR sensor provides non-contact, real-time, closed-loop temperature control throughout the reflow process. In addition, four (4) thermocouple inputs provide additional real-time monitoring (includes 2 K-type thermocouples) High Definition Optical Alignment System - Vision Overlay System (VOS) with High Definition (1080p) color camera, integrated frame grabber, dichroic beam-splitting prism, independently controlled LED illumination for component and PCB. Up to 240x zoom capability and Stable Zoom. Motorized Optics Housing Sodr-Cam Allows the developer to watch the entire reflow process in real time to verify solder melt. The camera arm rotates to provide a 180-degree view at a fixed distance, for minimal focus adjustment and ease of use. Quad-Field Imaging - For large component alignment (including fine-pitch QFPs), allows up to four opposite corners of a large component (and its pads) to be viewed under higher magnification Single Axis Operation - All operations, including component pick-up, alignment, placement, reflow & active cooling are completed in a single axis, eliminating risk of component movement after placement and reflow. Auxiliary Cooling Fan - Standard, for secondary cooling of the PCB Component Nests - Two (2) removable and adjustable Component Nests provided for perfect centering of components, in preparation for vacuum pick-up/placement. Optional component holding system for parts under 5mm Sq. Flux Dip Plate - Included; allows for automated flux dipping Stencils/Solder Paste - Over 145 stencil kits are optionally available (requires Universal Bracket Kit) and are integrated into the installation process #Advanced Features Ultra-High Precision Placement Capability: Motorized reflow head is driven by advanced stepper motor system providing smooth, high precision, repeatable movement with no drift, allowing for soft landing of components and 28µm (.0011") placement accuracy. High Sensitivity Vacuum Pick: New Vacuum Pick design is more robust, utilizes an optical sensor, is counterweight balanced, and employs precision high-temperature linear ball bearings for maximum accuracy and sensitivity in placement and pick-up. Sodr-Cam Reflow Camera: Provided Sodr-Cam allows the operator to verify the entire reflow process, including the exact moment of solder melt. Height Adjustable Bottom-Side Preheater: High powered (1000W) IR preheater height is adjustable from standard position up to 38mm (1.5") closer to the PCB for the most challenging high-thermal -mass boards. High-Definition Optical Alignment System: Automated Vision Overlay System uses a beam-splitting prism, high intensity LEDs for shadow-free lighting and a new high definition 1080p camera for easy alignment. Quad-Field Imaging for Large/Fine Pitch BGA's: Allows up to four corners of a large component (and its lands) to be viewed under high magnification, providing perfect alignment of outsized BGAs or fine-pitch QFPs. Integrated Board Support Wand: Prevents warping or sagging during reflow, is extremely adjustable to clear parts on the bottom of PCB and is easily removed when not in use. Power Distribution Graph: Provides a graphical analysis of the top heater output within each zone, helping the developer make necessary adjustments to either the bottom heater utilization, or ramp rate, to maximize thermal performance. Sensor Offset: Allows the developer to easily match the pyrometer temperature reading to the actual solder temperature #Video https://www.youtube.com/watch?v=HIcafwOKT1A&list=RDCMUCT5e-XjqHPfA3_9wF3CgY1w