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Quick Lead Free Hot Air Rework Centre 1300w output - QUITR1350

SKU QUITR1350
by Quick
Original price $0.00 - Original price $0.00
Original price $0.00
$2,475.00
$2,475.00 - $2,475.00
Current price $2,475.00
TR1350

Power 1300W

Operating voltage 110V/ 220V AC

Temperature range 100 to 500 Deg C

Air volume 6-70 L/Min


Overall dimensions 215 x 230 x 155 (mm)

Split type hot air pen


Program fast switch


ESD grounding monitoring


Network communication


Temperature automatic correction


Programmable temperature zone

#Applications


Suitable for reworking various components, such as SOIC, CHIP, QFP, SOP, PLCC, SOJ, BGA and QFN

Application: Heat shrinkage, drying, paint removal, defrostation, preheating, sterilizing, adhesive soldering etc.

Air volume adjustable, suitable for small and large air volume heating occasions.

Suitable for lead-free hot air reworking occasion.

Stock available: 1

Features & Benefits

High Power Output (1300 W): Rapid heating for efficient soldering and rework.Wide Temperature Range (100–500°C): Suitable for a wide variety of components and lead-free soldering.Adjustable Air Volume (6–70L/min): Flexible for small or large surfaces, allowing controlled heat application.Programmable Temperature Zones: Enables precise and repeatable temperature settings for complex workflows.Automatic Temperature Correction: Maintains stable and accurate temperatures for consistent results.Split-Type Hot Air Pen: Lightweight and ergonomic for precise handling during rework.Fast Switch Programs: Quick access to commonly used temperature and airflow settings.ESD Grounding Monitoring: Protects sensitive electronic components from electrostatic discharge.Network Communication: Supports monitoring, integration, and process control in professional environments.

Specifications

TR1350Power 1300WOperating voltage 110V/ 220V ACTemperature range 100 to 500 Deg CAir volume 6-70 L/MinOverall dimensions 215 x 230 x 155 (mm)Split type hot air penProgram fast switchESD grounding monitoringNetwork communicationTemperature automatic correctionProgrammable temperature zone

More Information

Suitable for reworking various components, such as SOIC, CHIP, QFP, SOP, PLCC, SOJ, BGA and QFN Application: Heat shrinkage, drying, paint removal, defrostation, preheating, sterilizing, adhesive soldering etc. Air volume adjustable, suitable for small and large air volume heating occasions. Suitable for lead-free hot air reworking occasion.