Circuit Medic Dry Film Adh Backing CirBoard Repair

Dry Film Adhesive Backing is available separately. Each piece is 2.25" x 1.50" (57mm x 38mm)

Overall Frame Size 2.25" x 1.50" (57 x 38 mm)
Base Material Rolled annealed copper foil .0014" (.036 mm) thick.
Adhesive Backing Phenolic Butral film adhesive .0018" (.046 mm) thick.
Bonding Temperature 475F +/- 25F (246C +/- 14C)
Bonding Time 30 seconds
Peel Strength Minimum 8 lbs/inch (1.43 kg/cm) after cure to FR-4 material.
Shelf Life 6 months minimum. Each Circuit Frame is stamped with the expiration date.
Plating Options Tin/Lead - .0005" (.0127 mm) 60/40 Tin/Lead minimum. *
Bright Tin (Lead Free) - .0005" Tin (.0127 mm) minimum.
Nickel/Gold - Gold .000050" (.00127 mm) minimum over Nickel .000100" (.00254 mm) minimum.