BGA Rework Equipment
The IR 3000 is the newest and most advanced component rework system available on the market. The IR 3000 is fully Area Array capable and can...
The IR 1000 is capable of installing and removing passives, QFPs, SOICs, PLCCs, MLFs, TSOPs, and coarse pitched BGAs. The IR 1000 incorpora...
IR3100 Infrared BGA Rework Station
The IR 3100 can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's.
Featuring a ...
The IR 3100 can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's.
Featuring a ...
IR4100 Infrared BGA Rework Station
The IR 3100 can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's.
Featuring a ...
The IR 3100 can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's.
Featuring a ...
Quick BGA Rework System EA-H15
Features
1. The infrared sensor is used to detect the surface temperature of BGA. So the closed-loop con...
Features
1. The infrared sensor is used to detect the surface temperature of BGA. So the closed-loop con...
SMD Rework System
Desolders, places and solders many types of surface mounted devices including BGA, CGA, QFN, QFP, PLCC, MLF and Flip Chip...
Desolders, places and solders many types of surface mounted devices including BGA, CGA, QFN, QFP, PLCC, MLF and Flip Chip...
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