BGA Rework Equipment
IR3100 Infrared BGA Rework Station
The IR 3100 can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's.
Featuring a ...
The IR 3100 can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's.
Featuring a ...
The IR 1000 is capable of installing and removing passives, QFPs, SOICs, PLCCs, MLFs, TSOPs, and coarse pitched BGAs. The IR 1000 incorpora...
IR4100 Infrared BGA Rework Station
The IR 3100 can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's.
Featuring a ...
The IR 3100 can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD's.
Featuring a ...
Quick BGA Rework System EA-H15
Features
1. The infrared sensor is used to detect the surface temperature of BGA. So the closed-loop con...
Features
1. The infrared sensor is used to detect the surface temperature of BGA. So the closed-loop con...
SMD Rework System
Desolders, places and solders many types of surface mounted devices including BGA, CGA, QFN, QFP, PLCC, MLF and Flip Chip...
Desolders, places and solders many types of surface mounted devices including BGA, CGA, QFN, QFP, PLCC, MLF and Flip Chip...
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