EFD Flux Paste Gel No- Clean 10g Syringe

FluxPlus dispensable and printable paste fluxes are designed to meet a wide variety of fluxing needs and are formulated to perform well with all dispensing and printing technologies in use today. Electronic assembly applications include BGA/PGA sphere and pin attachment, BGA and other rework, and fluxing of
pre-bumped flip chips and solder pads.
Plunger sold separately and is available on request.

Designed for both dispensing and printing. It offers up to eight (8) hours of print life and four (4) hours of tack time. It offers exceptional lot-to-lot consistency with excellent dispense and print resolution and reproducibility
No Clean - Residue is designed to be left in place for typical applications.

Controlled flux spread as a result of precise dispensing
Holds small parts in place before soldering
Delivers more flux compared to flux-core wire solder
Formulas for wetting to difficult-to-solder surfaces (stainless steel, etc.)
Compatible with range of dispensing solutions, including jetting systems

Manufacture and repair of BGAs (screen
printing materials with contrasting color)
SMT rework and repair
Fluxing of pre-bumped solder pads
Prototype development and production

Material Properties: J-STD-004
Classification: ROL0
Copper Mirror: No Breakthrough
Silver Chromate: Pass
Fluoride Spot: Pass
Corrosion: None
SIR 24 hours* :1.1 x 10 Ohms
SIR 96 hours*: 9.7 x 10E9 Ohms
SIR 168 hours*: 7.0 x 10E9 Ohms
Acid Value: (ASTM D-465-82), 105 +/- 10
Colour: Amber - colourless, transparent, hard, non-corrosive, inert, and designed to be left on your assembly.
Specific Gravity:1.01 +/- 0.05
Percent Solids: 59 +/- 2%
Penetration Value: (ASTM D-937-92) 200 +/- 25 mm
Storage: Between 4 degrees Can 21degrees C (40F and 70F). Do not Freeze. Allow four (4) hours at room temperature before using. Exposure to temperatures in excess of 27degrees C may cause chemical decomposition.
Best Working Environment: 20 degrees C to 25 degrees C (68F to 77F) at 35% to 60% Relative Humidity
Heating Guideline: Max 330 degrees C
Packaging Size: 10cc. Other sizes available (30cc, 55cc, and 70cc syringes; 6 oz cartridges; and 2 oz and 6 oz jars), please enquire.

6-412 MSDS Flux Paste 6-410 Nordson_EFD_Leaded_Rosin_Solder_Paste