Henkel Technomelt PA 648 Black 20Kg Bag

A circuit board protection (Coating). UV stable low pressure moulding encapsulant based on Henkel‘s polyamide hot melt technology. Multicore Loctite is a division of Henkel

Circuit Board Protection (Coating)
Low application pressure
Excellent adhesion to all substrates
Extended UV stability
No need for curing ovens, UV light etc.
Recyclable resins
Specific gravity of material less than potting compounds
Savings on material consumption
Complete watertight encapsulation
Low capital equipment costs
Low pressure and high speed moulding for electronics encapsulation

Brand Henkel Technomelt
Material: PA 648 (Macromelt OM648)
Colour: Black
Operating temperature:(-40/+100°C)
UL rating: 94-V-0
Fast cycle time: (15-45 seconds)
Safe: 1-component,
UL 94-V-0: Approved
Size: 20Kg's

Photovoltaic junction boxes and connectors
LED lighting
RFID tags
Industrial sensors
General electronics used in outdoor environments

HENOC648 - TDS Technomelt Low Pressure Molding Product Selection Guide