Hakko 808 Desoldering Tool

The Hakko 808 Desoldering Tool is a portable, handheld desoldering unit designed for removing solder from printed circuit boards and electronic components. It integrates a vacuum-pump mechanism to suck molten solder, making it suitable for electronics, electrical, and automotive repair tasks.

Features & Benefits:
*Portable all-in-one design: No separate station needed, ideal for field service and repair.
*Comfortable grip with low vibration: Allows longer use with less fatigue.
*High vacuum suction: Efficient removal of molten solder.
*Adjustable temperature control: 380 °C - 480 °C for different solder types.
*ESD/grounding safety: Safe for sensitive components.
*Easy maintenance: Removable pump cover and replaceable parts.

Specifications:
*Manufacturer: Hakko
*Part number: 808
*Power consumption: 100 W
*Heating element: 80 W ceramic heater
*Motor output: 6.5 W
*Temperature range: 380 °C - 480 °C
*Tip-to-ground potential: <2 mV
*Tip-to-ground resistance: <2 O
*Vacuum pump: Double-cylinder diaphragm
*Vacuum pressure: ~600 mmHg (~80 kPa)
*Suction flow: 10 L/min
*Dimensions: 170 mm × 235 mm
*Weight: 420 g
*Standard nozzle diameter: Ø 1.0 mm

Applications:
*Removal of through-hole and SMD components from PCBs.
*Rework of automobile electronic modules and ECUs.
*Maintenance of electrical assemblies for component replacement.
*On-site field service and repair work.
*Educational or training use in electronics rework.