Hakko Hot Air Nozzle For 850/850 QFP 10 X 10

The Hakko A1125B is a precision QFP-style hot air nozzle measuring 10.2 × 10.2 mm, designed expressly for fine-pitch IC packages. It is intended for use with Hakko hot air rework stations such as FR-802, FR-803B, FR-811, FR-850, FR-852, and select others. Engineered for even airflow and accurate thermal coverage, this nozzle simplifies the rework process for quad flat-pack (QFP) components.

Features:
*Delivers a 10.2 × 10.2 mm rectangular hot air profile optimized for QFP packages.
*Precisely machined to ensure uniform air distribution over all pins.
*Compatible with multiple Hakko rework systems including FR-801 through FR-852 models.
*Durable construction to withstand repeated thermal cycling.
*Designed for efficient preheating, removal, or placement of QFP devices.

Specifications:
*Manufacturer: Hakko
*Part Number: A1125B
*SKU: HKA1125B
*Nozzle Shape: QFP-style rectangular
*Inside Dimensions: 10.2 × 10.2 mm (0.40 in × 0.40 in)
*Compatible Hot-Air Stations: FR-802, FR-803B, FR-811, FR-810B, FR-850, FR-852 (Adapter may be required for FR-810 without B5058 adapter)
*Material: Heat-resistant alloy or stainless steel suited for high temperatures

Applications:
*Precision rework of Quad Flat Package (QFP) integrated circuits.
*Effective for soldering, preheating, and removal of QFP ICs on dense PCB layouts.
*Ideal in electronics manufacturing, SMT repair, and prototype debugging.
*Prevents component damage by applying uniform heat distribution during removal or installation.
*Supports both lead-free and conventional soldering workflows in high-frequency rework environments.


In New Zealand Baskiville are authorised agents for Hakko
Baskiville stock and support Hakko products
Contact us on 0508-227-548 for more product information or discount quotes for bulk purchases

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