Hakko Hot Air Nozzle For 850/852 QFP 28 X 28

The Hakko A1129B is a precision hot air nozzle designed specifically for rework of Quad Flat Package (QFP) components measuring approximately 28.2 × 28.2 mm. Engineered for compatibility with several Hakko hot air rework systems, this nozzle delivers consistent airflow and targeted heating to ensure efficient soldering and desoldering of medium to large QFP components. Its structure supports precise heat transfer while minimizing risk to adjacent parts, making it ideal for rework applications in electronics manufacturing and repair.

Features:
*Designed for QFP components measuring approximately 28.2 × 28.2 mm.
*Provides even heat distribution around all sides of the component.
*Suitable for medium to large-sized QFP package removal and installation.
*Compatible with vacuum pickup functions on supported rework systems.
*Ensures controlled airflow to protect surrounding components.
*Built for use in production, prototyping, and repair environments.

Specifications:
*Manufacturer: Hakko
*Part number: A1129B
*SKU: HKA1129B
*Nozzle type: Hot air nozzle for QFP
*Compatible package size: 28.2 mm × 28.2 mm
*Suitable systems: Hakko 850, 850B, 850D, 852, FR-801, FR-802, FR-803B, FR-810B, FR-811
*Nozzle shape: Square
*Construction: Durable metal structure for long-term use

Uses:
*Electronics rework involving QFP components on PCBs.
*Desoldering and soldering of integrated circuits in electronics repair.
*SMT reflow operations on medium to large QFP chips.
*Use in R&D labs, production lines, and service centers.
*Applicable in high-precision industries such as automotive electronics, communications, and consumer electronics.


In New Zealand Baskiville are authorised agents for Hakko
Baskiville stock and support Hakko products
Contact us on 0508-227-548 for more product information or discount quotes for bulk purchases

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