Hakko BGA Nozzle

The Hakko A1476 is a conventional hot-air nozzle designed for use with BGA packages measuring 36 × 36 mm with a height of 15 mm. Built for Hakko rework stations, it delivers focused and even heat distribution to aid in efficient soldering and desoldering of large BGA components, ensuring minimal thermal spread to surrounding circuitry.

Features:
*BGA-specific nozzle shaped to fit 36 × 36 × 15 mm package outlines.
*Provides concentrated hot-air flow for accurate heating of targeted BGA chips.
*Constructed with durable metal material suitable for heavy rework usage.
*Maintains consistent thermal performance and tip clearance through extended use.

Specifications:
*Manufacturer: Hakko
*Part Number: A1476
*SKU: HKA1476
*Nozzle Type: Conventional hot-air nozzle
*Target Package Size: 36 × 36 mm footprint; 15 mm height
*Compatible Stations: FR-811, FR-810B, FR-803B, FR-803, FR-802, FR-801, FR-850, FR-850B, FR-850D, FR-852
*Adapter Required: B5058 adapter required when used with FR-810
*Material: Heat-resistant metal alloy for stable air flow and longevity

Applications:
*Heating and removal of BGA components sized 36 × 36 × 15 mm during PCB rework.
*Precision-focused hot-air delivery to reflow targeted IC packages without affecting nearby components.
*Ideal for prototyping, repair, and refurbishment of densely populated electronic assemblies.
*Suitable for industrial electronics technicians working with BGA solder joints, multi-layer PCBs, and complex layouts.