Hakko N51-25 BGA Nozzle 38mm x 38mm for FR810/FR811

The Hakko N51-25 is a large-footprint BGA hot-air rework nozzle sized 38 mm × 38 mm, designed for use with Hakko FR-810, FR-810B and FR-811 rework stations. It is engineered for removal and replacement of very large ball-grid-array (BGA) packages on densely populated PCBs. By matching the nozzle outlet size to the component footprint, the N51-25 facilitates efficient, focused hot-air delivery while reducing heat exposure to adjacent components—ideal for electronics, electrical and automotive module rework tasks.

Features & Benefits:
*Quick-change style mounting for fast and efficient nozzle swaps.
*Outlet inner dimensions of 38 mm × 38 mm tailored for very large BGA packages.
*Compatible with Hakko FR-810, FR-810B and FR-811 rework systems.
*Robust metal construction for high-temperature hot-air applications.
*Focused airflow helps reduce thermal stress on neighbouring components, improving re-work reliability and yield.

Specifications:
*Manufacturer: Hakko
*Part Number: N51-25
*SKU: HKN51-25
*Nozzle Type: BGA hot-air nozzle (quick-change style)
*Outlet Inner Dimensions: 38 mm × 38 mm
*Suitable For: Hakko FR-810, FR-810B, FR-811

Applications:
*Re-work and repair of very large BGA chips on printed circuit boards (PCBs).
*Service of automotive modules and control units where large BGA packages are used.
*Maintenance of high-density electronics, electrical systems and industrial instrumentation boards.
*Production line repair or prototype re-work of consumer electronics, networking or medical devices with large-footprint components.
*Process improvement & tooling optimisation in hot-air re-work operations requiring matched nozzle size for thermal efficiency.