Greases & Heat Transfer Compounds

TCOR is a single component, 100% solids, low odour silicone RTV which cures upon exposure to atmospheric moisture. It has been designed to fill the gap between device and heat sink, thus reducing the thermal resistance. It can be applied around components and power resistors to dissipate
excess heat to heat sinks, avoiding any potential overheating and subsequent failures. It can also be used as a low bond strength adhesive, sealant or gasketing compound.

Higher bond strength than standard RTVs; can be used as a sealant or thermal adhesive
High thermal conductivity; combines adhesive properties with efficiency of heat dissipation
Very wide operating temperature range; combines properties required for the automotive market
Single component, non-slump; ideal for applications requiring a higher viscosity product
RoHS Compliant

Size:75ml
Packaging: Syringe
Colour: White
Viscosity @ 1rpm (Pa s): 140-150
Consistency: Non-Slump Paste
Density @ 20°C (g/ml): 2.3
Shrinkage on Cure >0.2%
Skin Forming Rate*: 10-15 minutes
Cure Time @ 20°C*: 24 hours
*Curing rate and skin forming is dependent upon ambient conditions of temperature and humidity

Thermal Conductivity: 1.8 W/m.K
Temperature Range: -50 to +230ºC
Maximum Operating Temperature (30mins): +250ºC
Shore Hardness: A75
Tensile Strength: 2 MPa
Peel Strength: >4 Kgf (aluminium)
Tear Strength: 1.52 Kgf
Breaking Strength: 4.30 Kgf
Elongation at Break: 300%
Dielectric Strength: >8 kV/mm
Electrical Insulation: 1 x 1014 Ohm/cm