Statfree High Density Foam is ideal for lead insertion packaging, providing ESD and physical protection to component leads, and bringing terminals to equipotential, minimizing exposure to discharge.
* Antistatic, low tribocharging - Minimizes charge generation; material will conduct charges if grounded
* Dissipative - corrosion resistant - Ideal for long term storage
* Uniform protection - Will not affect the solder ability of device leads
* Lead-free RoHS Compliant
* Made in the United States of America
Size: 9.4mm x 610mm x 914mm
Volume Resistivity: 10E3 - 10E5 ohms
Surface Resistivity: 10E3 - 10E5 ohms
