High temperature tape & discs

TAPE, WESCORP, POLYIMIDE, HI TEMP, 1/2 IN x 36 YDS

* Removal leaves little or no residue
* Masking off PCBs for IR reflow ovens or wave soldering under
572°F (300°C) ~ 10 seconds
* Near zero voltage generation when tape removed from PCB
(at 50% relative humidity)
* Near zero voltage generation when tape unrolled from roll
(at 50% relative humidity)
* Low-sloughing plastic core
* Ideal for masking gold leads and other components on boards
populated with sensitive integrated circuits
* For best results apply to board using a rubber roller
* Adhesive surface resistivity
10E3 to 10E4 Ohms
* Max Temperature
572°F (300°C) 10 seconds
* Adhesive Strength
1 N/cm (DIN), 5 oz./in2 (ASTM)
* 1.0 mil thick (0.0254mm) Polyimide Film (DuPont Kapton® or equivalent)
* Conductive Polysiloxide Adhesive
* Total Thickness
0.060 mm (DIN), 2.4 mil (ASTM)
* Colour
Brown opaque
* Adhesive Type
Silicone
* Tensile Strength
50 N/cm (DIN), 28 lbs/in2 (ASTM)
* Elongation
70% (DIN & ASTM)
* Lead-free RoHS compliant

DES81271 TDS.