SOLDER PASTE WITH NO-CLEAN FORMULATION Henkel Loctite Corp. SN62 Alloy
A new solder paste, Multicore MP218, is a halide-free, no-clean formulation. MP218 is pin-testable and offers broad process windows for both printing and reflow. It also exhibits high resistance to humidity, even after 24 hrs at 75 percent relative humidity.
The paste achieves a consistently high degree of coalescence upon reflow. During printing and assembly, the benefits of specifying MP218 are low paste wastage the result of high tack life and an open time of more than 24 hrs and resistance to component movement
during high-speed placement, due to its high initial tack force, measured at 1.6g/mm2. Multicore MP218 is suitable for reflow in air or nitrogen, providing solder ability on a wide range of surface finishes. Post-reflow, the solder paste leaves colourless residues to ease visual inspection.
Being of soft, non-stick consistency, the residues also permit reliable in-circuit testing without clogging test probes, even after being subjected to double reflow and many hundreds of tests.
* Outstanding humidity resistance gives excellent coalescence even after 24 hours exposure to 75%RH, thus reducing process variation due to environmental factors
* Colourless residues for easy post-reflow inspection
* Soft non-stick pin testable residues allow easy in-circuit testing
* Suitable for fine pitch, high speed printing up to 150mm/s (6/s)
* Extended open time & tack-life leading to low wastage.
* Halide free flux classification: ROL0 to ANSI/J-STD-004
Multicore Loctite is a division of Henkel
