PACE's TJ-70 Mini ThermoJet provides safe, rapid installation or removal of chip components, SOT's, SOIC's, PLCC's, QFP's and other surface mounted devices via controlled convective/hot air.
Can also be brought as part of a kit with a cubby, P/N 6993-0206-P1
PACE's TJ-70 Mini ThermoJet provides safe, rapid installation or removal of chip components, SOT's, SOIC's, PLCC's, QFP's and other surface mounted devices via controlled convective/hot air.
Suits older MBT250 type stations with black plug (connectors).
Compatible with stations that have black din plugs (SensaTemp Model). MBT220 sensa temp rework stations, older MBT100 and MBT201
A finger-actuated air switch and IntelliHeat Control provide safe, "instant use" capability without constant running of an air pump.
Pencil grip design lets you target controlled heat right at the solder joints without affecting adjacent components solder or damaging the pc board.
Effective for heat shink tubing applications and for conformal coating removal via convective softening of urethanes/over-curing of epoxies
