BGA Rework Equipment

Quick BGA Rework System EA-H15

Features
1. The infrared sensor is used to detect the surface temperature of BGA. So the closed-loop control and the even heat distribution is realized.
2. The PL part of the infrared BGA rework station is designed with dichromatic vision alignment, which realizes the good coordination of the solder ball and the pad.
3. The machine is connected with PC via IRSoft to record and analyse the operating process, and form the curve.

Specifications

IR
* Power: 2600W (Max.)

* Bottom Preheating Power: 1600W (400W×4, dark infrared heater)
2000W (500W×4, high infrared heating tube, optional)

* Power of Top Heater: 720W (120W×6, infrared heating tube, wave length: 2-8µm)

* Range of Top Heating Area: 20-60mm (X, Y adjustable)

* Bottom Preheating Area: 290×290mm

* Max. PCB Size 400×400mm

* Communication: USB (Connected with PC)

* Temperature Sensor: Non-contact infrared sensor

* Weight: About 55kg

* Dimension: 850(L)×650(W)×730(H)mm

PL
* Camera: 22×10 times magnifying; 12V/300mA; Horizontal resolution: 480 lines; PAL format

* Prism Size: 50mm×50mm

*BGA Size Range: 2×2-60×60(mm)

*Video Output Signal: Video signal

RPC
* RPC: 22×10 times magnifying
Horizontal resolution: 480 lines
PAL format

Note: monitor is not the standard configuration for this product. It is optional.