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The Hakko A1261B is a hot air nozzle designed for QFP packages approximately 20 × 20 mm in size. It is fully compatible with Hakko’s hot air rework systems, including the 850, 852, FR-801, FR-802, FR-803/B, FR-810B, and FR-811. The nozzle supports vacuum pick-up functionality when used with appropriate systems, enabling precise and safe rework of medium-sized QFP components.

Features:
*Specifically sized for QFP packages measuring approximately 20 × 20 mm.
*Vacuum pick-up function is operative when used with compatible Hakko systems.
*Provides uniform airflow surrounding the full perimeter of the component for even heating.
*Enables controlled reflow and safe removal of medium-sized QFP devices.
*Constructed from durable materials to maintain consistent thermal performance and reliability over time.

Specifications:
*Manufacturer: Hakko
*Part number: A1261B
*SKU: HKA1261B
*Nozzle type: QFP hot air nozzle
*Aperture size: Approximately 20.2 × 20.2 mm
*Compatible systems: Hakko FR-801, FR-802, FR-803, FR-803B, FR-810B, FR-811, and 850, 850B, 850D, 852 (requires adapter B5058 for FR-810/FR-811)
*Vacuum pick-up support: Yes, when used with systems that support vacuum function

Uses:
*Reworking QFP-type integrated circuit packages approximately 20 × 20 mm on printed circuit boards.
*Performing precision soldering or desoldering of medium-size QFP devices during repair, diagnostics, or prototyping.
*Conducting controlled reflow in dense SMT layouts while reducing heat impact on adjacent components.
*Ideal for use in service centers, production environments, and R&D labs with Hakko hot air systems.
*Suitable for vacuum-assisted component removal or placement for safe and clean rework operations.


In New Zealand Baskiville are authorised agents for Hakko
Baskiville stock and support Hakko products
Contact us on 0508-227-548 for more product information or discount quotes for bulk purchases

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