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The Hakko A1264B is a hot air nozzle engineered for large-format QFP packages measuring approximately 40 × 40 mm, suitable for high-pin-count surface-mount ICs. Designed for use with Hakko’s hot air rework stations (models 850, 852, FR-801, FR-802, FR-803/B, FR-810B, FR-811), it supports vacuum pick-up functionality when installed on systems that include suction capability.

Features:
*Specifically crafted for QFP components around 40 × 40 mm in size.
*Vacuum pick-up function remains operative on compatible Hakko rework systems.
*Delivers uniform airflow completely around component edges for balanced and efficient heating.
*Enables precise removal or placement of large-format QFP devices.
*Fabricated from robust materials to ensure long-term thermal performance and stability.

Specifications:
*Manufacturer: Hakko
*Part number: A1264B
*SKU: HKA1264B
*Nozzle type: QFP large-format hot air nozzle
*Aperture size: Approximately 40.4 × 40.4 mm
*Compatible systems: Hakko FR-801, FR-802, FR-803B, FR-810B, FR-811, 850, 850B, 850D, 852 (adapter required for FR-810/811)
*Vacuum pick-up support: Yes, when used on systems supporting vacuum-assisted functionality

Uses:
*Ideal for reworking large 40 × 40 mm QFP packages on printed circuit boards.
*Suitable for precision soldering or desoldering of high-pin-count ICs in repair, prototyping, and production.
*Enables controlled reflow in dense SMT assemblies while minimizing thermal stress on surrounding components.
*Well-suited for R&D labs, electronics service centers, and manufacturing environments using Hakko hot air systems.
*Compatible with vacuum-assisted component removal or placement to maintain clean, accurate rework operations.


In New Zealand Baskiville are authorised agents for Hakko
Baskiville stock and support Hakko products
Contact us on 0508-227-548 for more product information or discount quotes for bulk purchases

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